 |
Bonding Conditions Range
|
Melting Point for Resin in Heat-seal process.(Peak Temperature) |
 |
140°C~160°C(H TYPE) 110°C~130°C(B TYPE) |
|
|
A |
Sealing time |
|
5±2sec(H TYPE) |
|
B |
Temperature setting at Surface of HSC when sealing |
|
Min. 140°C (H TYPE) |
|
C |
Sealing pressure |
|
30~40 kg/sqcm2 |
