title-06 
 

Bonding Conditions Range

 

Melting Point for Resin in Heat-seal process.(Peak Temperature)

140°C~160°C(H TYPE)

110°C~130°C(B TYPE)

A

Sealing time

5±2sec(H TYPE)

B

Temperature setting at Surface of HSC when sealing


Min. 140°C (H TYPE)

C

Sealing pressure

30~40 kg/sqcm2
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